GlobalWafers Corp (環球晶圓), the world’s third-largest silicon wafer supplier, yesterday said its board of directors has approved a cash dividend distribution of NT$5 per share, 37.5 percent lower than a year ago, due to weak net profits in the first half of this year.
It is the lowest cash dividend issued by the company since 2021, when it shifted its cash dividend policy to pay shareholders twice a year.
Last year, the company distributed a cash dividend of NT$8 for its earnings of NT$22.49 per share in the first two quarters.
Photo: Ann Wang, Reuters
The latest cash dividend distribution represented a payout ratio of 35.61 percent based on its earnings per share (EPS) of NT$14.04 during the six-month period ended in June.
The payout ratio is below the payout ratio of up to 80 percent over the past few years and fell short of the company’s earlier estimate of 50 percent to 55 percent of its overall EPS, or distributable profits.
GlobalWafers shareholders used to receive dividends of 60 percent to 80 percent of EPS.
GlobalWafers intends to hold more cash, as it expects to face challenges over the next three years given its plans to invest in capacity and technology for future growth and repay debt, company chairwoman Doris Hsu (徐秀蘭) told investors last month.
The company’s policy was to pay less in cash dividends, she said.
The Hsinchu-based silicon wafer manufacturer last month posted its worst monthly revenue since April, totaling NT$5.12 billion (US$157.83 million). That represented an annual decline of 2.38 percent from NT$5.24 billion.
Revenue dipped 10.65 percent from NT$5.73 billion in October. GlobalWafers expected a gradual pickup in revenue, saying the revenue this quarter would increase from NT$15.9 billion last quarter.
The company said it hoped revenue next year would return to last year’s level of NT$70.65 billion, an all-time high.
During the first 11 months, the company accumulated NT$57.13 billion in revenue, falling 11.03 percent from NT$64.22 billion in the same period last year.
Taiwan would remain in the same international network for carrying out cross-border payments and would not be marginalized on the world stage, despite jostling among international powers, central bank Governor Yang Chin-long (楊金龍) said yesterday. Yang made the remarks during a speech at an annual event organized by Financial Information Service Co (財金資訊), which oversees Taiwan’s banking, payment and settlement systems. “The US dollar will remain the world’s major cross-border payment tool, given its high liquidity, legality and safe-haven status,” Yang said. Russia is pushing for a new cross-border payment system and highlighted the issue during a BRICS summit in October. The existing system
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) is expected to grow its revenue by about 25 percent to a new record high next year, driven by robust demand for advanced technologies used in artificial intelligence (AI) applications and crypto mining, International Data Corp (IDC) said yesterday. That would see TSMC secure a 67 percent share of the world’s foundry market next year, from 64 percent this year, IDC senior semiconductor research manager Galen Zeng (曾冠瑋) predicted. In the broader foundry definition, TSMC would see its market share rise to 36 percent next year from 33 percent this year, he said. To address concerns
Intel Corp chief financial officer Dave Zinsner said that a formal separation of the company’s factory and product development divisions is an open question that would be decided by the chipmaker’s next leader. Zinsner, who is serving as interim co-CEO following this month’s ouster of Pat Gelsinger, made the remarks on Thursday at the Barclays technology conference in San Francisco alongside co-CEO Michelle Johnston Holthaus. Intel’s struggles to keep pace with rivals — along with its deteriorating financial condition — have spurred speculation that the next CEO would make dramatic changes. That has included talk of a split of the company’s manufacturing
PROTECTIONISM: The tariffs would go into effect on Jan. 1 and are meant to protect the US’ clean energy sector from unfair Chinese practices, the US trade chief said US President Joe Biden’s administration plans to raise tariffs on solar wafers, polysilicon and some tungsten products from China to protect US clean energy businesses. The notice from the Office of US Trade Representative (USTR) said tariffs on Chinese-made solar wafers and polysilicon would rise to 50 percent from 25 percent and duties on certain tungsten products would increase from zero to 25 percent, effective on Jan. 1, following a review of Chinese trade practices under Section 301 of the US Trade Act of 1974. The decision followed a public comment period after the USTR said in September that it was considering