China Development Financial Holding Corporation (hereinafter referred to as “CDF”) launched a high-level management team reshuffle. Today (26th), the Board of Directors approved Alan Wang to succeed as the Chairman and Paul Yang to take over as President & CEO. At the same time, CDF has appointed the positions of Chairman and President for its subsidiaries: Alan Wang will also serve as Chairman of KGI Life Insurance, Yu-ling Kuo will serve as President of KGI Life Insurance, and Paul Yang will serve as Chairman of KGI Bank. The new management team officially take office and will lead CDF to a new milestone.
CDF stated that under the leadership of Chairman, Alan Wang and President & CEO, Paul Yang, the new management team will fully utilize group resources, maximize business synergies, promote the growth of KGI Bank’s assets and distributions; build business and investment profitability growth momentum for KGI Life Insurance to respond to changes in the market environment; strengthen the development of KGI Securities’ wealth management and overseas business; deepen cooperation between CDIB Capital Group and Taiwan’s high-tech companies, and develop private equity products suitable for Taiwan’s wealth management market; improve the overall financial performance of CDF and maintain a consistently stable dividend policy.
Alan Wang and Yu-ling Kuo have a wealth of experiences in the insurance industry. As the insurance industry is about to align with IFRS17 and ICS, KGI Life has also recruited Winston Yung and Andy Lin to serve as Senior Executive Vice Presidents. Winston Rung has served as a director of McKinsey & Company (Hong Kong) and as CEO of the Hong Kong region, where he has successfully helped KGI Life in developing business distributions and digital transformation with remarkable achievement. He has rich experiences in insurance industry; Andy Lin, who has served as the CFO of CDF and KGI Bank, is well-versed in financial management affairs and has comprehensive experience within the group. In the future, they will assist KGI Life in smoothly integrating and maximizing synergies at the areas of business distribution, organizational momentum and financial management.
Photo courtesy of CDF
Paul Yang, CDF President & CEO and KGI Bank Chairman, has extensive experience in financial management, investment and M&A. In the past, during his tenure at CDF, he successfully transformed China Development Industrial Bank into a regional asset management firm and expanded CDF’s business roadmap in commercial banking and securities business through M&A. In the future, he will make good use of the advantages of the group and develop a balance approach in the three major pillars of personal banking, corporate banking and financial markets to steadily expand the scale of various businesses.
Steve Bertamini, the former President & CEO of CDF, vigorously promoted the company’s transformation during his tenure, introduced many advanced foreign systems to enhance employee engagement and NPS, and his achievements are outstanding. He will continue to serve as a Board of director at CDF. In addition, CDIB appointed David Chou as Vice Chairman at the beginning of the year. David Chou has served as Managing Director, Asia Investment Director and Global Partner of Goldman Sachs, and has more than 25 years of experience in the international financial market, providing M&A advisory services for American industrial, high-tech and manufacturing transactions.
CDF stated that through the high-level management reshuffle, CDF’s new management team will lead the group to open up a new pattern of innovation and become a leading financial institution in Asia.
Nvidia Corp’s demand for advanced packaging from Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) remains strong though the kind of technology it needs is changing, Nvidia CEO Jensen Huang (黃仁勳) said yesterday, after he was asked whether the company was cutting orders. Nvidia’s most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a complex chip-on-wafer-on-substrate (CoWoS) advanced packaging technology offered by TSMC, Nvidia’s main contract chipmaker. “As we move into Blackwell, we will use largely CoWoS-L. Of course, we’re still manufacturing Hopper, and Hopper will use CowoS-S. We will also transition the CoWoS-S capacity to CoWos-L,” Huang said
Nvidia Corp CEO Jensen Huang (黃仁勳) is expected to miss the inauguration of US president-elect Donald Trump on Monday, bucking a trend among high-profile US technology leaders. Huang is visiting East Asia this week, as he typically does around the time of the Lunar New Year, a person familiar with the situation said. He has never previously attended a US presidential inauguration, said the person, who asked not to be identified, because the plans have not been announced. That makes Nvidia an exception among the most valuable technology companies, most of which are sending cofounders or CEOs to the event. That includes
TARIFF TRADE-OFF: Machinery exports to China dropped after Beijing ended its tariff reductions in June, while potential new tariffs fueled ‘front-loaded’ orders to the US The nation’s machinery exports to the US amounted to US$7.19 billion last year, surpassing the US$6.86 billion to China to become the largest export destination for the local machinery industry, the Taiwan Association of Machinery Industry (TAMI, 台灣機械公會) said in a report on Jan. 10. It came as some manufacturers brought forward or “front-loaded” US-bound shipments as required by customers ahead of potential tariffs imposed by the new US administration, the association said. During his campaign, US president-elect Donald Trump threatened tariffs of as high as 60 percent on Chinese goods and 10 percent to 20 percent on imports from other countries.
INDUSTRY LEADER: TSMC aims to continue outperforming the industry’s growth and makes 2025 another strong growth year, chairman and CEO C.C. Wei says Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), a major chip supplier to Nvidia Corp and Apple Inc, yesterday said it aims to grow revenue by about 25 percent this year, driven by robust demand for artificial intelligence (AI) chips. That means TSMC would continue to outpace the foundry industry’s 10 percent annual growth this year based on the chipmaker’s estimate. The chipmaker expects revenue from AI-related chips to double this year, extending a three-fold increase last year. The growth would quicken over the next five years at a compound annual growth rate of 45 percent, fueled by strong demand for the high-performance computing