SK Hynix Inc plans to spend US$3.87 billion building an advanced packaging plant and research center for artificial intelligence (AI) products in Indiana, marking a win for US President Joe Biden’s administration as it seeks to increase semiconductor output on US soil.
The world’s No. 2 memorychip maker said it would build its first US facility in West Lafayette, with plans to begin mass production in the second half of 2028. The plant will center on a production line for next-generation high-bandwidth memory (HBM) chips, critical components of the graphic processors that train AI systems.
SK Hynix has evolved into a key player in the AI development boom as the leading designer and producer of HBM chips, which work in tandem with Nvidia Corp’s processors.
Photo: AFP
Its decision comes about two years after the company announced plans to invest in the US. At the time, SK Group chairman Chey Tae-won said his conglomerate would set aside about US$15 billion to build chip facilities and bolster research programs in the US.
Wednesday’s announcement is part of that total commitment, the company said.
SK Hynix has also applied for grants from the CHIPS and Science Act, which is aimed at promoting the return of semiconductor manufacturing to the US.
SK Hynix’s project marks a significant step forward for US ambitions to add advanced packaging capacity — a bottleneck in Washington’s efforts to revitalize the domestic semiconductor industry. The US has only 3 percent of the world’s packaging capacity, meaning that firms manufacturing chips in the US often still have to ship them to Asia to be assembled for use.
Semiconductor firms have pledged to invest more than US$230 billion on US soil since Biden took office, spurred by the 2022 chips legislation.
Intel Corp last month won US$8.5 billion in grants and as much as US$11 billion in loans from the US to support more than US$100 billion in investments at home.
The Biden administration also plans to award more than US$6 billion to SK Hynix rival Samsung Electronics Co and more than US$5 billion to Taiwan Semiconductor Manufacturing Co (TSMC, 台積電).
Most of those investments have so far gone to Texas, New York and Arizona. The Grand Canyon state alone has secured more than US$60 billion in investments from TSMC, Intel, Amkor Technology Inc and dozens of others.
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) would not produce its most advanced technologies in the US next year, Minister of Economic Affairs J.W. Kuo (郭智輝) said yesterday. Kuo made the comment during an appearance at the legislature, hours after the chipmaker announced that it would invest an additional US$100 billion to expand its manufacturing operations in the US. Asked by Taiwan People’s Party Legislator-at-large Chang Chi-kai (張啟楷) if TSMC would allow its most advanced technologies, the yet-to-be-released 2-nanometer and 1.6-nanometer processes, to go to the US in the near term, Kuo denied it. TSMC recently opened its first US factory, which produces 4-nanometer
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