Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) is expected to inaugurate a new 1.4-nanometer fab in Taichung, the most advanced operated by the world’s biggest contract chipmaker, in 2027, after the government approved zoning changes for the project, the Taichung City Government said yesterday.
The new fab is expected to generate NT$1.2 trillion (US$38 billion) in production value, together with companies that would also operate in the newly planned industrial area, the city government said, citing a Central Taiwan Science Park (中部科學園區) estimate.
“TSMC hopes to add capacity for its second-phase expansions in Taichung to cope with customer demand. The chipmaker operates three fabs in the city now,” Taichung Mayor Lu Shiow-yen (盧秀燕) said yesterday.
Photo: Su Meng-chuan, Taipei Times
TSMC plans to build four 12-inch fabs, utilizing more advanced technology than its 2-nanometer technology, the city government said.
The project is expected to create 4,200 jobs.
Lu’s remarks came after the Ministry of the Interior approved the zoning changes proposed by the Taichung City Government for the land that has been allocated for the new TSMC fab.
As a major portion of the land is privately held by a single owner, who operates a golf course there, the land appropriation should be easier, the city government said.
The Central Taiwan Science Park administration would be in charge of land appropriation.
TSMC’s 2-nanometer chips are scheduled to be available next year. The chipmaker’s 3-nanometer chips are already being used in Apple Inc’s latest iPhone 15 series.
TSMC is expanding its global footprint to satisfy customer demand and boost supply chain resilience, while further developing advanced wafer manufacturing and packaging technologies in Taiwan.
The company plans to budget between US$28 billion and US$32 billion for capital expenditures this year, with about 70 to 80 percent of it earmarked for advanced technology capacity expansion, it said.
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