Christian Koitzsch, former head of Robert Bosch GmbH’s wafer plant in Dresden, is now serving as the president of Taiwan Semiconductor Manufacturing Co’s (TSMC, 台積電) subsidiary in Germany, according to the CEO of Silicon Saxony, an industrial group in Germany.
In a LinkedIn post on Thursday, Silicon Saxony CEO Frank Bosenberg said Koitzsch had switched jobs in the new year to become the president of European Semiconductor Manufacturing Co (ESMC), a joint venture of TSMC, auto part maker Bosch and IC suppliers Infineon Technologies AG and NXP Semiconductors NV.
As the CEO of ESMC, Koitzsch is expected to supervise the building of an advanced wafer fab in Dresden as part of the joint venture. ESMC is scheduled to break ground on the fab in the second half of this year.
Photo: AFP
Koitzsch, a physicist, held various roles at Bosch and has headed the company’s Dresden Bosch plant since July 2021.
The plant is well known for its advanced automation
production in rolling out auto industry chips and has been described as the most sophisticated wafer fab in Europe. The new TSMC fab is being built next to it.
In August last year, TSMC, the world’s largest contract chipmaker, announced it would team up with Bosch, Infineon and NXP to set up ESMC, in which the Taiwanese partner would hold a 70 percent stake and the three foreign partners would own the remaining 30 percent.
It would be the first TSMC production base in Germany, with mass production slated to begin at the end of 2027.
Kellner emphasized that TSMC’s and Intel’s investment plans were critical to long-term economic development in Germany.
As part of its global expansion efforts, TSMC’s fab in Dresden is to use 12-nanometer, 16-nanometer, 22-nanometer and 28-nanometer processes to produce chips for automotive electronics and specialty industrial devices.
TSMC is also building two fabs in the US state of Arizona and another in Kumamoto, Japan.
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) would not produce its most advanced technologies in the US next year, Minister of Economic Affairs J.W. Kuo (郭智輝) said yesterday. Kuo made the comment during an appearance at the legislature, hours after the chipmaker announced that it would invest an additional US$100 billion to expand its manufacturing operations in the US. Asked by Taiwan People’s Party Legislator-at-large Chang Chi-kai (張啟楷) if TSMC would allow its most advanced technologies, the yet-to-be-released 2-nanometer and 1.6-nanometer processes, to go to the US in the near term, Kuo denied it. TSMC recently opened its first US factory, which produces 4-nanometer
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