Two electric buses developed by Hon Hai Precision Industry Co (鴻海精密) are today to begin offering circular shuttle services in the Hsinchu Science Park (新竹科學園區).
Speaking with reporters at a ceremony to inaugurate the two e-bus services, Hsinchu Science Park Bureau director-general Wayne Wang (王永壯) said the e-buses would run between the park’s section in Miaoli County’s Jhunan Township (竹南) and the Hsinchu high-speed rail station in Hsinchu County’s Jhubei City (竹北), meeting the needs of staffers in the park, while also reducing carbon emissions.
The e-buses rolled out by Foxtron Vehicle Technologies Co (鴻華先進), a joint venture between Hon Hai and Yulon Motors Co (裕隆), are equipped with a lane departure warning system and a forward collision warning system, Wang said.
Photo: Annabelle Chih, Reuters
The park would study the services before deciding whether to use more e-buses, Wang added.
The Hon Hai-developed e-buses were made based on the “Model T” prototype the company unveiled in October 2021.
Michael Kuo (郭耀聰), an aide to Foxtron CEO Andy Lee (李秉彥), said the company expects shipments of Model T based e-buses to range from 105 and 110 units this year after 50 were shipped in the first half of the year.
Last year, only 20 units were shipped, Lee said.
Foxtron started to ship Model T based e-buses to Kaohsiung in March last year, and provided the same model to Taipei, Tainan, Taitung and outlying Kinmen County, as well as to Indonesia.
Taichung Bus Co (台中客運) in central Taiwan is scheduled to adopt the model in October, Kuo added.
The New Taiwan dollar is on the verge of overtaking the yuan as Asia’s best carry-trade target given its lower risk of interest-rate and currency volatility. A strategy of borrowing the New Taiwan dollar to invest in higher-yielding alternatives has generated the second-highest return over the past month among Asian currencies behind the yuan, based on the Sharpe ratio that measures risk-adjusted relative returns. The New Taiwan dollar may soon replace its Chinese peer as the region’s favored carry trade tool, analysts say, citing Beijing’s efforts to support the yuan that can create wild swings in borrowing costs. In contrast,
Nvidia Corp’s demand for advanced packaging from Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) remains strong though the kind of technology it needs is changing, Nvidia CEO Jensen Huang (黃仁勳) said yesterday, after he was asked whether the company was cutting orders. Nvidia’s most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a complex chip-on-wafer-on-substrate (CoWoS) advanced packaging technology offered by TSMC, Nvidia’s main contract chipmaker. “As we move into Blackwell, we will use largely CoWoS-L. Of course, we’re still manufacturing Hopper, and Hopper will use CowoS-S. We will also transition the CoWoS-S capacity to CoWos-L,” Huang said
Nvidia Corp CEO Jensen Huang (黃仁勳) is expected to miss the inauguration of US president-elect Donald Trump on Monday, bucking a trend among high-profile US technology leaders. Huang is visiting East Asia this week, as he typically does around the time of the Lunar New Year, a person familiar with the situation said. He has never previously attended a US presidential inauguration, said the person, who asked not to be identified, because the plans have not been announced. That makes Nvidia an exception among the most valuable technology companies, most of which are sending cofounders or CEOs to the event. That includes
INDUSTRY LEADER: TSMC aims to continue outperforming the industry’s growth and makes 2025 another strong growth year, chairman and CEO C.C. Wei says Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), a major chip supplier to Nvidia Corp and Apple Inc, yesterday said it aims to grow revenue by about 25 percent this year, driven by robust demand for artificial intelligence (AI) chips. That means TSMC would continue to outpace the foundry industry’s 10 percent annual growth this year based on the chipmaker’s estimate. The chipmaker expects revenue from AI-related chips to double this year, extending a three-fold increase last year. The growth would quicken over the next five years at a compound annual growth rate of 45 percent, fueled by strong demand for the high-performance computing