FTX cofounder Sam Bankman-Fried while on bail should be allowed a cellphone with no Internet capability and a basic laptop with limited functions, but forbidden from using other electronic communication devices, the US Department of Justice said.
The proposal to limit the his communications was filed late on Friday in Manhattan Federal Court in New York, on behalf of the government and Bankman-Fried’s defense team.
It requires approval by US District Judge Lewis Kaplan, who oversees the case.
Photo: AP
Kaplan had signaled at a Feb. 16 hearing that he might jail Bankman-Fried, 30, for testing the limits of his US$250 million bail package by communicating in ways that could not be monitored.
The judge said he did not want to set Bankman-Fried “loose in this garden of electronic devices,” following accusations that he tried to contact possible government witnesses, and used a virtual private network to watch football.
Bankman-Fried pleaded not guilty after prosecutors said he stole billions of US dollars of FTX customer funds to plug losses at his Alameda Research hedge fund.
He faces 12 criminal charges under an indictment made public on Feb. 23.
The proposed non-smartphone for Bankman-Fried would be limited to voice calls and SMS text messages.
Laptop Internet use would be restricted to specified virtual private networks, 23 Web sites for personal use covering news, sports and food delivery, and other Web sites.
Bankman-Fried is living under house arrest with his parents in Palo Alto, California.
His parents agreed to submit sworn affidavits that they would not bring other electronic devices into their home or let their son use theirs.
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
People walk past advertising for a Syensqo chip at the Semicon Taiwan exhibition in Taipei yesterday.
NO BREAKTHROUGH? More substantial ‘deliverables,’ such as tariff reductions, would likely be saved for a meeting between Trump and Xi later this year, a trade expert said China launched two probes targeting the US semiconductor sector on Saturday ahead of talks between the two nations in Spain this week on trade, national security and the ownership of social media platform TikTok. China’s Ministry of Commerce announced an anti-dumping investigation into certain analog integrated circuits (ICs) imported from the US. The investigation is to target some commodity interface ICs and gate driver ICs, which are commonly made by US companies such as Texas Instruments Inc and ON Semiconductor Corp. The ministry also announced an anti-discrimination probe into US measures against China’s chip sector. US measures such as export curbs and tariffs