Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), the world’s biggest contract chipmaker, has decided to slow down its 3-nanometer chip production as Intel Corp, one of its major customers, plans to push back the launch of its new Meteor Lake tGPU chipsets to the end of next year, market researcher TrendForce Corp (集邦科技) said yesterday.
That means Intel has canceled almost all of the 3-nanometer capacity booked for next year, with only a small amount of wafer input remaining for engineering verification, the Taipei-based researcher said in a report.
Based on Intel’s original schedule, TSMC was to start producing the new chipsets in the second half of this year using its 3-nanometer technology, which would be the most advanced technology in global chip production, TrendForce said.
Photo: Cheng I-hwa, Bloomberg
Issues linked to product design and process verification can be blamed for the delay, it said.
The postponement would severely affect TSMC’s plan to ramp up 3-nanometer chips, as it leaves Apple Inc as the only customer for the technology in the next one-and-a-half years, the researcher said.
Apple plans to adopt the 3-nanometer technology for its M-series processors and A17 Bionic chip, it said.
TSMC has said that it planned to start mass production of 3-nanometer chips in the second half of this year. The chips would be used in high-performance-computing (HPC)and smartphone applications, it said.
To avoid booking hefty depreciation and amortization costs for new 3-nanometer equipment and idled capacity, TSMC has notified its equipment suppliers about the order adjustments for next year, it said.
The order cuts could lead to a reduction in capital spending for next year, compared with this year’s record US$40 billion, given that 3-nanometer equipment is costly, it said.
TrendForce said TSMC should expect a slower revenue growth than expected. The company last month raised its sales growth forecast for this year to 35 percent.
However, 2024 could be a good year for TSMC’s sales and factory utilization, TrendForce said.
Major customers for TSMC’s advanced technology, including Advanced Micro Devices Inc, MediaTek Inc (聯發科) and Qualcomm Inc, are to use the 3-nanometer process technology in 2024 for their cutting-edge chips, while Apple is to fully adopt 3-nanometer chips for its new iPhone series, it said.
In addition, TSMC might see an additional revenue boost from Intel, which could outsource production of its computing tiles to TSMC if its Intel 4 process technology development stagnates, the researcher said.
HANDOVER POLICY: Approving the probe means that the new US administration of Donald Trump is likely to have the option to impose trade restrictions on China US President Joe Biden’s administration is set to initiate a trade investigation into Chinese semiconductors in the coming days as part of a push to reduce reliance on a technology that US officials believe poses national security risks. The probe could result in tariffs or other measures to restrict imports on older-model semiconductors and the products containing them, including medical devices, vehicles, smartphones and weaponry, people familiar with the matter said. The investigation examining so-called foundational chips could take months to conclude, meaning that any reaction to the findings would be left to the discretion of US president-elect Donald Trump’s incoming team. Biden
INVESTMENT: Jun Seki, chief strategy officer for Hon Hai’s EV arm, and his team are currently in talks in France with Renault, Nissan’s 36 percent shareholder Hon Hai Precision Industry Co (鴻海精密), the iPhone maker known as Foxconn Technology Group (富士康科技集團) internationally, is in talks with Nissan Motor Co’s biggest shareholder Renault SA about its willingness to sell its shares in the Japanese automaker, the Central News Agency (CNA) said, citing people it did not identify. Nissan and fellow Japanese automaker, Honda Motor Co, are exploring a merger that would create a rival to Toyota Motor Corp in Japan and better position the combined company to face competitive challenges around the world, people familiar with the matter said on Wednesday. However, one potential spanner in the works is
HON HAI LURKS: The ‘Nikkei’ reported that Foxconn’s interest in Nissan accelerated the Honda-merger effort out of fears it might be taken over by the Taiwanese firm Nissan Motor Co has become the latest buyout target in Japan as it explores a merger with Honda Motor Co and faces an overture from Hon Hai Precision Industry Co (鴻海精密), known as Foxconn Technology Group (富士康科技集團) internationally. Shares in Nissan yesterday jumped 24 percent, the most on record, to hit the daily limit, after the two Japanese automakers acknowledged that talks are ongoing to better position themselves for competitive challenges during a time of upheaval in the global auto industry. Foxconn — a Taipei-based manufacturer of iPhones, which has been investing heavily in factories to build electric vehicles — has also
CHIP SUBSIDY: The US funding would help alleviate the financial pressure from building two fabs in the US and should lift gross margins in 2026, the company said GlobalWafers Co (環球晶圓), the world’s third-largest silicon wafer supplier, yesterday said it is to receive US$406 million in subsidies from the US Department of Commerce for two new US fabs under the CHIPS and Science Act, with the first batch of the funds likely coming next year. The grant represents 10 percent of the planned investments of US$4 billion in advanced semiconductor wafer manufacturing facilities in Texas and Missouri, GlobalWafers said. The commerce department is to disburse the funds based on the completion of project milestones over a multiyear timeframe, the company said. Along with the tax credit, which is equal to