The COVID-19 pandemic has hit the world hard, changed people’s lives and pushed contactless services into the mainstream.
The Discovery Channel noticed the rapid digital transformation taking place in Taiwan’s financial industry and took six months to produce the Tomorrow by Taiwan: Virtual World program, which premiered at 10pm on Wednesday.
The program showed how CTBC Bank (中國信託商銀) pays attention to the customer experience and uses artificial intelligence (AI), blockchain, cloud technology and big data to provide financial services that are available anytime, anywhere.
Photo courtesy of the Discovery Channel
Tomorrow by Taiwan: Virtual World was hosted by TV personality Janet Hsieh (謝怡芬), who led the audience in exploring the development of financial technology in the post-pandemic era.
The program aired on the Discovery Channel in 13 countries and territories in Asia, including Taiwan, Hong Kong, Macau, Singapore, Malaysia, the Philippines, Indonesia and Thailand.
CTBC has had excellent performance in the digitalization of its financial services.
In particular, the bank has processed more than 360,000 COVID-19 relief loan applications per year over the two years of the pandemic, the highest output among Taiwan’s private banks.
CTBC president James Chen (陳佳文) said that the bank’s online platform for processing relief loans integrates cash data with information data to provide a contactless application service.
A crucial step for digital innovation at the bank was its adoption of a “mobile first” approach six years ago, which it has invested in ever since.
The pandemic has also helped to accelerate the digital transformation, making it more acceptable to the public.
In the next stage, the challenge for the financial industry will be to increase the capabilities of digital services, Chen said.
Only firms that can provide high-quality remote digital services will remain competitive, he added.
CTBC has been using blockchain technology to provide corporate customers with a smoother trade finance process.
In 2016, the bank took the lead in joining the R3 Alliance, the largest international financial blockchain ecosystem, becoming the first R3 Alliance member in Taiwan.
By adopting blockchain technology to replace the complicated and time-consuming issuance of letters of credit, and using AI technology to automatically identify traditional Chinese documents, the bank has optimized the international trade finance process.
CTBC has made good use of big data, and is implementing end-to-end digitization to build a personalized smart financial environment for its customers and provide them with a better experience.
To extend the reach of its financial services, the bank has been working with partners such as Line Pay, CPC Pay and Hotai Pay to build a more convenient financial ecosystem.
CTBC has also taken the lead in adopting Apple Inc’s Business Chat financial service, which is integrated directly into Apple’s Messages app.
Zhang Yazhou was sitting in the passenger seat of her Tesla Model 3 when she said she heard her father’s panicked voice: The brakes do not work. Approaching a red light, her father swerved around two cars before plowing into a sport utility vehicle and a sedan, and crashing into a large concrete barrier. Stunned, Zhang gazed at the deflating airbag in front of her. She could never have imagined what was to come: Tesla Inc sued her for defamation for complaining publicly about the vehicles brakes — and won. A Chinese court ordered Zhang to pay more than US$23,000 in
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said that its investment plan in Arizona is going according to schedule, following a local media report claiming that the company is planning to break ground on its third wafer fab in the US in June. In a statement, TSMC said it does not comment on market speculation, but that its investments in Arizona are proceeding well. TSMC is investing more than US$65 billion in Arizona to build three advanced wafer fabs. The first one has started production using the 4-nanometer (nm) process, while the second one would start mass production using the
US President Donald Trump has threatened to impose up to 100 percent tariffs on Taiwan’s semiconductor exports to the US to encourage chip manufacturers to move their production facilities to the US, but experts are questioning his strategy, warning it could harm industries on both sides. “I’m very confused and surprised that the Trump administration would try and do this,” Bob O’Donnell, chief analyst and founder of TECHnalysis Research in California, said in an interview with the Central News Agency on Wednesday. “It seems to reflect the fact that they don’t understand how the semiconductor industry really works,” O’Donnell said. Economic sanctions would
‘NO DISRUPTION’: A US trade association said that it was ready to work with the US administration to streamline the program’s requirements and achieve shared goals The White House is seeking to renegotiate US CHIPS and Science Act awards and has signaled delays to some upcoming semiconductor disbursements, two sources familiar with the matter told reporters. The people, along with a third source, said that the new US administration is reviewing the projects awarded under the 2022 law, meant to boost US domestic semiconductor output with US$39 billion in subsidies. Washington plans to renegotiate some of the deals after assessing and changing current requirements, the sources said. The extent of the possible changes and how they would affect agreements already finalized was not immediately clear. It was not known