Taiwan Mobile Co (台灣大哥大) yesterday said it has invested US$20 million in series E round of funding for Vietnam’s biggest e-commerce company, Tiki Corp, as it seeks to gain a foothold in rapidly growing greater Southeast Asian (GSEA) markets.
The strategic investment is Taiwan Mobile’s first in Vietnam and would help the company and its e-commerce subsidiary, Momo.com Inc (富邦媒體), explore potential partners and new growth opportunities beyond its home market, the nation’s second-biggest telecom operator said.
“The strategic cooperation with Tiki is the company’s first investment in Vietnam. It also marks the company’s first strategic and meaningful step to make inroads into the country and GSEA markets,” Taiwan Mobile president Jamie Lin (林之晨) said in a statement.
Photo: CNA
Taiwan Mobile considers GSEA markets as one of its 5G development targets and would continue to seek new strategic partnerships in the area, including e-commerce, logistics, broadband and 5G-related applications, with the goal of becoming a major telecom and technology services provider in the region, the statement said.
Ho Chi Minh City-based Tiki started out as an online bookstore and has since developed into an e-commerce operator selling a wide range of goods, it said.
The transaction would help Momo.com tap into the rapidly growing e-commerce market in Vietnam and allow it to leverage Tiki’s local strength in terms of market position, warehouses and logistic systems. The companies expect to create synergies in expanding sales and logistics, the statement said.
From last year to 2025, the e-commerce market in Vietnam is expected to post an annual compound growth rate of 34 percent to reach US$29 billion, Taiwan Mobile said, citing a joint report by Google, Temasek Holdings Pte and Bain & Co.
Momo.com, which contributed more than 50 percent to Taiwan Mobile’s revenue, has been cautious about its overseas expansion. It operates a TV sales unit in Thailand.
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) has secured three construction permits for its plan to build a state-of-the-art A14 wafer fab in Taichung, and is likely to start construction soon, the Central Taiwan Science Park Bureau said yesterday. Speaking with CNA, Wang Chun-chieh (王俊傑), deputy director general of the science park bureau, said the world’s largest contract chipmaker has received three construction permits — one to build a fab to roll out sophisticated chips, another to build a central utility plant to provide water and electricity for the facility and the other to build three office buildings. With the three permits, TSMC
RUN IT BACK: A succesful first project working with hyperscalers to design chips encouraged MediaTek to start a second project, aiming to hit stride in 2028 MediaTek Inc (聯發科), the world’s biggest smartphone chip supplier, yesterday said it is engaging a second hyperscaler to help design artificial intelligence (AI) accelerators used in data centers following a similar project expected to generate revenue streams soon. The first AI accelerator project is to bring in US$1 billion revenue next year and several billion US dollars more in 2027, MediaTek chief executive officer Rick Tsai (蔡力行) told a virtual investor conference yesterday. The second AI accelerator project is expected to contribute to revenue beginning in 2028, Tsai said. MediaTek yesterday raised its revenue forecast for the global AI accelerator used
The DBS Foundation yesterday announced the launch of two flagship programs, “Silver Motion” and “Happier Caregiver, Healthier Seniors,” in partnership with CCILU Ltd, Hondao Senior Citizens’ Welfare Foundation and the Garden of Hope Foundation to help Taiwan face the challenges of a rapidly aging population. The foundation said it would invest S$4.91 million (US$3.8 million) over three years to foster inclusion and resilience in an aging society. “Aging may bring challenges, but it also brings opportunities. With many Asian markets rapidly becoming super-aged, the DBS Foundation is working with a regional ecosystem of like-minded partners across the private, public and people sectors
BREAKTHROUGH TECH: Powertech expects its fan-out PLP system to become mainstream, saying it can offer three-times greater production throughput Chip packaging service provider Powertech Technology Inc (力成科技) plans to more than double its capital expenditures next year to more than NT$40 billion (US$1.31 billion) as demand for its new panel-level packaging (PLP) technology, primarily used in chips for artificial intelligence (AI) applications, has greatly exceeded what it can supply. A significant portion of the budget, about US$1 billion, would be earmarked for fan-out PLP technology, Powertech told investors yesterday. Its heavy investment in fan-out PLP technology over the past 10 years is expected to bear fruit in 2027 after the technology enters volume production, it said, adding that the tech would