Samsung Electronics Co is considering a second location in Texas for its planned US$17 billion US semiconductor plant, a signature project that could address US concerns about chip security while expanding its own capabilities.
The South Korean company is exploring another 6 million square feet (557,418m2) site apart from a previously disclosed expansion of its Austin base, according to documents filed with the local government. If it goes ahead, Samsung would begin construction at the Williamson Country site in the first quarter of next year, with production expected to commence in the final quarter of 2024.
Samsung is weighing options for an advanced chipmaking plant in the US, in hopes of winning more US clients and narrowing the gap with industry leader Taiwan Semiconductor Manufacturing Co (TSMC, 台積電).
Photo: Reuters
The company had been in discussions to build a facility in Austin, Texas, capable of fabricating chips as advanced as 3 nanometers, people familiar with the matter have said.
Dubbed Project Silicon Silver, that plan included adding about 650,000m2 of new space to the Austin campus, where the company has had operations for decades. It called for investment of about US$17 billion and the creation of about 1,800 jobs over the first 10 years, according to an economic impact study prepared by a local consultant. Those objectives were echoed in the filing made public on Thursday for Williamson County, which is just north of Austin.
In a January filing, the company detailed a timeline for the Austin project that spanned breaking ground in the second quarter of this year, with production up and running by the fourth quarter of 2023.
It is also evaluating alternative sites in Arizona and New York, as well as in South Korea.
Samsung is taking advantage of a concerted US government effort to counter China’s rising economic prowess and lure back home some of the advanced manufacturing that over the past decades has gravitated toward Asia.
US President Joe Biden last month laid out a sweeping effort to secure the nation’s critical supply chains, including a proposed US$52 billion to bolster domestic chip manufacturing.
The hope is that such production bases in the US would galvanize local businesses and support US industry and chip design. Intel Corp’s troubles ramping up on technology and its potential reliance in the future on TSMC and Samsung for at least some of its chipmaking only underscored the extent to which Asian giants have forged ahead in recent years.
If Samsung goes ahead, it would effectively go head-to-head on US soil with TSMC, which is on track to build its own US$12 billion chip fab in Arizona by 2024.
Samsung is trying to catch TSMC in the so-called foundry business of making chips for the world’s corporations — a particularly pivotal capability given a deepening shortage of semiconductors.
Under Samsung family scion Jay Y. Lee, the company has said it wants to be the biggest player in the US$400 billion chip industry. It plans to invest US$151 billion through 2030 into its foundry and chip design businesses, aiming to catch TSMC by offering chips using 3-nanometer process technology next year.
Nvidia Corp’s demand for advanced packaging from Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) remains strong though the kind of technology it needs is changing, Nvidia CEO Jensen Huang (黃仁勳) said yesterday, after he was asked whether the company was cutting orders. Nvidia’s most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a complex chip-on-wafer-on-substrate (CoWoS) advanced packaging technology offered by TSMC, Nvidia’s main contract chipmaker. “As we move into Blackwell, we will use largely CoWoS-L. Of course, we’re still manufacturing Hopper, and Hopper will use CowoS-S. We will also transition the CoWoS-S capacity to CoWos-L,” Huang said
Nvidia Corp CEO Jensen Huang (黃仁勳) is expected to miss the inauguration of US president-elect Donald Trump on Monday, bucking a trend among high-profile US technology leaders. Huang is visiting East Asia this week, as he typically does around the time of the Lunar New Year, a person familiar with the situation said. He has never previously attended a US presidential inauguration, said the person, who asked not to be identified, because the plans have not been announced. That makes Nvidia an exception among the most valuable technology companies, most of which are sending cofounders or CEOs to the event. That includes
TARIFF TRADE-OFF: Machinery exports to China dropped after Beijing ended its tariff reductions in June, while potential new tariffs fueled ‘front-loaded’ orders to the US The nation’s machinery exports to the US amounted to US$7.19 billion last year, surpassing the US$6.86 billion to China to become the largest export destination for the local machinery industry, the Taiwan Association of Machinery Industry (TAMI, 台灣機械公會) said in a report on Jan. 10. It came as some manufacturers brought forward or “front-loaded” US-bound shipments as required by customers ahead of potential tariffs imposed by the new US administration, the association said. During his campaign, US president-elect Donald Trump threatened tariffs of as high as 60 percent on Chinese goods and 10 percent to 20 percent on imports from other countries.
INDUSTRY LEADER: TSMC aims to continue outperforming the industry’s growth and makes 2025 another strong growth year, chairman and CEO C.C. Wei says Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), a major chip supplier to Nvidia Corp and Apple Inc, yesterday said it aims to grow revenue by about 25 percent this year, driven by robust demand for artificial intelligence (AI) chips. That means TSMC would continue to outpace the foundry industry’s 10 percent annual growth this year based on the chipmaker’s estimate. The chipmaker expects revenue from AI-related chips to double this year, extending a three-fold increase last year. The growth would quicken over the next five years at a compound annual growth rate of 45 percent, fueled by strong demand for the high-performance computing