Wistron Group (緯創集團) yesterday announced a strategic partnership with Microsoft Corp Taiwan’s artificial intelligence research and development center, whereby the two firms would create an office in Kaohsiung for artificial intelligence and big data-related products and services.
Wistron is also to invest NT$50 million (US$1.69 million) over the next two years to develop new talent in the area, Wistron Corp (緯創資通) vice chairman Robert Huang (黃柏漙) told a news conference in Taipei.
The office is part of the contract electronics manufacturer’s “digital transformation” from an original design manufacturer into a technology service provider, Huang said.
Photo: CNA
“Big data is not just for big business … it is the company’s mission to help all businesses embrace digital technology,” he said.
The Kaohsiung office is to have a strong emphasis on the cultivation of talent, as “we are growing people, not factories,” he added.
Artificial intelligence technologies are being developed for many different industries, and Wistron, in conjunction with Microsoft, plans to use its resources, as well its subsidiary WiAdvance Technology Co’s (緯謙科技) expertise in corporate digital transformation and smart manufacturing, to address various challenges facing local industries, Huang said.
Huang also serves as chairman of WiAdvance.
Tragedies such as the fire that killed six people at a karaoke parlor in Taipei in April could be avoided if inspectors could continually monitor firefighting equipment online, WiAdvance senior technology director Raymond Fan (范振煌) said.
Smart technology could also assist with disease prevention efforts by tracking individual’s movements and body temperature without compromising their privacy, he said.
As an example, Wistron has provided En Chu Kong Hospital (恩主公醫院) in New Taipei City’s Sanxia District (三峽) with a smart healthcare system incorporating remote capabilities.
The system allows medical instructions to be passed to patients and doctors to inspect how wounds are healing remotely, the company said.
Nvidia Corp’s demand for advanced packaging from Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) remains strong though the kind of technology it needs is changing, Nvidia CEO Jensen Huang (黃仁勳) said yesterday, after he was asked whether the company was cutting orders. Nvidia’s most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a complex chip-on-wafer-on-substrate (CoWoS) advanced packaging technology offered by TSMC, Nvidia’s main contract chipmaker. “As we move into Blackwell, we will use largely CoWoS-L. Of course, we’re still manufacturing Hopper, and Hopper will use CowoS-S. We will also transition the CoWoS-S capacity to CoWos-L,” Huang said
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