In a twist to the US’ import ban on various HTC Corp (宏達電) smartphones, the company yesterday said some of its products blocked by US customs because of patent-infringement concerns had been allowed to enter the US market after passing the customs’ review.
“Some of our products have passed the review and have been delivered to our telecoms operators’ clients in the US,” HTC said in a statement submitted to the Taiwan Stock Exchange yesterday.
The Taoyuan-based handset maker’s statement came after two of its flagship mobile phones, HTC One X and HTC EVO 4G LTE, were prevented by US customs from entering the country after the US International Trade Commission ruled late last year that HTC had infringed on a crucial patent held by Apple Inc.
“The company is closely working with the US customs to speed up the review,” HTC said in the statement. “The company is confident that the problem will be resolved soon.”
The US customs’ review went faster than a possible three-week examination estimated by Jeff Pu (蒲得宇), who tracks the handset industry for Fubon Securities (富邦證券), and that means the ban could have less impact on HTC’s revenue this quarter.
Originally, Pu expected US customs could spend up to three weeks checking HTC’s products, resulting in a reduction of 10 to 15 percent in the company’s revenue this quarter.
HTC, the world’s No. 5 smartphone maker, told investors last month that it expected revenue to grow 55 percent quarterly to NT$105 billion (US$3.55 billion) this quarter, recovering from a product transition period.
Last quarter, HTC’s shipments dropped 17 percent to 7.68 million units, compared with 9.3 million units in the previous year, because of competition from Apple Inc and Samsung, according to market researcher Gartner Inc’s statistics.
ARTIFICIAL INTELLIGENCE: The chipmaker last month raised its capital spending by 28 percent for this year to NT$32 billion from a previous estimate of NT$25 billion Contract chipmaker Powerchip Semiconductor Manufacturing Corp (力積電子) yesterday launched a new 12-inch fab, tapping into advanced chip-on-wafer-on-substrate (CoWoS) packaging technology to support rising demand for artificial intelligence (AI) devices. Powerchip is to offer interposers, one of three parts in CoWoS packaging technology, with shipments scheduled for the second half of this year, Powerchip chairman Frank Huang (黃崇仁) told reporters on the sidelines of a fab inauguration ceremony in the Tongluo Science Park (銅鑼科學園區) in Miaoli County yesterday. “We are working with customers to supply CoWoS-related business, utilizing part of this new fab’s capacity,” Huang said, adding that Powerchip intended to bridge
BUSINESS UPDATE: The iPhone assembler said operations outlook is expected to show quarter-on-quarter and year-on-year growth for the second quarter Hon Hai Precision Industry Co (鴻海精密) yesterday reported strong growth in sales last month, potentially raising expectations for iPhone sales while artificial intelligence (AI)-related business booms. The company, which assembles the majority of Apple Inc’s smartphones, reported a 19.03 percent rise in monthly sales to NT$510.9 billion (US$15.78 billion), from NT$429.22 billion in the same period last year. On a monthly basis, sales rose 14.16 percent, it said. The company in a statement said that last month’s revenue was a record-breaking April performance. Hon Hai, known also as Foxconn Technology Group (富士康科技集團), assembles most iPhones, but the company is diversifying its business to
Microsoft Corp yesterday said that it would create Thailand’s first data center region to boost cloud and artificial intelligence (AI) infrastructure, promising AI training to more than 100,000 people to develop tech. Bangkok is a key economic player in Southeast Asia, but it has lagged behind Indonesia and Singapore when it comes to the tech industry. Thailand has an “incredible opportunity to build a digital-first, AI-powered future,” Microsoft chairman and chief executive officer Satya Nadella said at an event in Bangkok. Data center regions are physical locations that store computing infrastructure, allowing secure and reliable access to cloud platforms. The global embrace of AI
RIDING AI WAVE: : Most of its NT$15bn capital budget would be spent on packaging technologies used in AI and HPC chips and advanced testing technology, it said Chip testing and packaging service provider Powertech Technology Inc (PTI, 力成科技) plans to increase this year’s capital expenditure by 50 percent to expand capacity to meet growing demand for advanced memorychips used in artificial intelligence (AI) products. The company proposed to spend NT$15 billion (US$460.94 million) to expand advanced capacity and equipment, compared with a budget of NT$10 billion it planned three months ago. “We are seeing a recovery in market demand as well as new business opportunities. We will spend heavily on advanced packaging” equipment, Powertech chief executive officer Boris Hsieh (謝永達) told investors on Tuesday. “We will focus on ramping