ELECTRONICS
Asustek sets ‘ZenTalk’ date
Asustek Computer Inc (華碩) yesterday said it is to convene its annual “ZenTalk” conference in Taipei on Aug. 26 to showcase its upcoming flagship handset, the ZenFone 4, and its augmented reality (AR) smartphone, the ZenFone AR, to consumers. It is the third consecutive year the company has hosted the conference in the city, as part of the firm’s strategy to promote its smartphones and create a closer relationship with its consumers. Asustek said a “high-ranking” executive would personally introduce the features of the new products and dine with the participants. Asustek has not yet sent out invitations to the ZenFone 4 product launch after the company reportedly postponed it from the end of this month to the middle of next month.
TECHNOLOGY
Kinsus net income plunges
Kinsus Interconnect Technology Corp (景碩科技), a silicon substrate manufacturing arm of Pegatron Corp (和碩), yesterday reported net income of NT$63.39 million (US$2.09 million) for last quarter, down from the NT$603.32 million it made in the same period last year. Earnings per share were NT$0.14, compared with last year’s NT$1.35. The result brought the company’s combined net profit for the first half to NT$199.94 million, down from NT$1.11 billion last year, according to a company filing with the Taiwan Stock Exchange. The company has not yet set a date for its investors’ conference, at which it plans to announce its outlook for the remainder of this year.
ELECTRONICS
Hon Hai in India talks
Hon Hai Precision Industry Co (鴻海精密) is in talks with a major industrial group in India to introduce low-end mobile phones in the nation, according to an Indian media report. The Economic Times reported over the weekend that Hon Hai, also known as Foxconn Technology Group (富士康), has entered into negotiations with Reliance Industries Ltd (RIL) to make low-priced mobile phones under Indian Prime Minister Narendra Modi’s “Make in India” initiative. The report said that Reliance Jio Infocomm, the telecom subsidiary of RIL, is planning to launch dual SIM mobile phones costing between US$23 and US$25. The report said that the mobile phones would be equipped with 2G and 4G SIM card slots and are expected to use chips designed by China’s Spreadtrum Communications Inc (展訊).
SHIPBUILDERS
CSBC Corp delivers vessel
CSBC Corp, Taiwan (台灣國際造船) yesterday said that TS Lines Co (德翔海運) has taken delivery of a 1,800 twenty-foot equivalent unit Bangkok-max vessel that it was commissioned to design and build. Despite a downturn in the global cargo shipping sector, TS Lines is committed to updating its fleet and the company has three more of the vessels on order, CSBC Corp said. The new vessel is 25 percent more fuel efficient than vessels built 10 years ago, the shipbuilder said.
ECONOMY
M1B grows 4.43 percent
M1B money supply, which refers to cash and cash equivalents, grew 4.43 percent year-on-year last month, faster than the broader gauge M2 — M1B, savings deposits, time savings deposits and foreign currency deposits — which grew 3.71 percent, the central bank said yesterday. As M1B is often linked to liquidity available for stock investments, the trend might reflect an upturn in investor confidence, as the two measures displayed a so-called “golden cross,” the bank said.
PATENTS: MediaTek Inc said it would not comment on ongoing legal cases, but does not expect the legal action by Huawei to affect its business operations Smartphone integrated chips designer MediaTek Inc (聯發科) on Friday said that a lawsuit filed by Chinese smartphone brand Huawei Technologies Co (華為) over alleged patent infringements would have little impact on its operations. In an announcement posted on the Taiwan Stock Exchange, MediaTek said that it would not comment on an ongoing legal case. However, the company said that Huawei’s legal action would have little impact on its operations. MediaTek’s statement came after China-based PRIP Research said on Thursday that Huawei filed a lawsuit with a Chinese district court claiming that MediaTek infringed on its patents. The infringement mentioned in the lawsuit likely involved
EXPECTATIONS: The firm, which is on track to outpace global foundry industry revenue growth, said it expects constrained advanced process capacity amid stronger AI demand Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday increased its projected revenue growth for this year to above 25 percent, as stronger-than-expected demand for premium smartphones and artificial intelligence (AI) devices are to drive greater utilization of cutting-edge 3-nanometer and 5-nanometer chips. In April TSMC estimated 21 to 24 percent annual growth. The firm’s revenue growth is on track to greatly outpace the global foundry industry, which is expected to rise about 10 percent this year. “Over the past three months, we have observed stronger AI and high-end smartphone demand from our customers, which is to boost the overall capacity utilization for our leading-edge
INVESTMENT: The company’s planned complex in Texas would be the first 12-inch silicon wafer fab built in the US in more than 20 years, a GlobalWafers official said GlobalWafers Co (環球晶圓), the world’s No. 3 silicon wafer supplier, yesterday said it secured up to US$400 million in direct funding from the US Department of Commerce under the CHIPS and Science Act for the construction of two new advanced fabs in the US. Its subsidiaries GlobalWafers America and MEMC LLC are to build a 12-inch silicon wafer fab in Sherman, Texas, and another one in Missouri to produce silicon-on-insulator (SOI) wafers used to make leading-edge chips. “With the support of the [US President Joe] Biden Administration, we are honored to be bringing to American shores the world’s most cutting-edge 12-inch semiconductor
Powerchip Semiconductor Manufacturing Co (力積電) yesterday said that net losses ballooned to NT$1.96 billion (US$60.1 million) in the second quarter, as heavy manufacturing costs from a new fab outweighed the improvement in customer demand and factory utilization. That compared with losses of NT$439 million in the first quarter. The company posted a net profit of NT$617 million a year earlier. Gross margin plummeted to 5.3 percent last quarter, from 15.4 percent in the previous quarter and 16.8 percent in the same period last year. It was the weakest since the fourth quarter of last year. The chipmaker blamed heavy depreciation and higher manufacturing