Greece and its international creditors were “very close” to a loan deal for the cash-strapped country, a Greek junior foreign minister said yesterday, a day ahead of a key meeting in Brussels.
“After weeks of painful negotiation, if the other side is willing, it will become apparent that ... the deal is very close and will be sealed in the coming period,” said Euclid Tsakalotos, one of Greece’s main negotiators.
Tsakalotos said Athens and its creditors were “politically apart” on labor and pension issues and that some areas “will remain open until the last minute.”
At a meeting of eurozone finance ministers today, Greece is hoping for a “positive statement” on negotiations that will allow for a section of 7.2 billion euros (US$8.1 billion) in remaining bailout loans to be released, officials have said.
However, European officials have played down the likelihood of a deal actually emerging today.
“We have made progress, but we are not very close to an agreement,” Eurogroup chair Jeroen Dijsselbloem told Italy’s Corriere della Sera daily. “It will surely not be reached at the Eurogroup meeting on Monday.”
Greece has been squeezing funds from the central and local governments to be able to meet its international loan payments, with concerns that within a matter of weeks it could default and face a messy exit from the euro. However, a loan repayment of 750 million euros due tomorrow to the IMF will be honored, according to sources in Athens.
A poll in Real News daily yesterday showed 71.9 percent of Greeks favored a compromise to keep the country in the eurozone.
And if the question was put to a referendum, as the government has indicated it may do, 49.2 percent said they would accept further salary and pension cuts if it meant keeping the euro.
Nvidia Corp’s demand for advanced packaging from Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) remains strong though the kind of technology it needs is changing, Nvidia CEO Jensen Huang (黃仁勳) said yesterday, after he was asked whether the company was cutting orders. Nvidia’s most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a complex chip-on-wafer-on-substrate (CoWoS) advanced packaging technology offered by TSMC, Nvidia’s main contract chipmaker. “As we move into Blackwell, we will use largely CoWoS-L. Of course, we’re still manufacturing Hopper, and Hopper will use CowoS-S. We will also transition the CoWoS-S capacity to CoWos-L,” Huang said
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