Handset producer HTC Corp (宏達電) said yesterday that it would continue with a lawsuit against Apple Inc, despite a US trade panel denying its petition to use some patents acquired from Google Inc.
The US International Trade Commission (USITC) determined a day earlier that it would not review an administrative law judge’s initial determination in a lawsuit between HTC and Apple that HTC cannot use five patents it bought from Google.
“We are disappointed in this decision and will pursue our available options,” HTC said.
“We will continue to aggressively protect our intellectual property against those who infringe upon it and look forward to presenting our case on the remaining patents to the judge at trial later this year,” the Taoyuan-based firm said.
In September last year, HTC amended the existing complaints it filed on Aug. 16 last year with the USITC and the US District Court of Delaware, as well as an additional case in Delaware, for patent infringement by Apple’s iOS devices and Mac computers.
HTC filed the claim with five of the nine patents it bought from Google, which originated from Palm Inc, Motorola Inc and Openwave Systems Inc, and were transferred to Google within the past year.
However, last month, the USITC rejected HTC’s bid to assert the five patents it obtained from Google, after Apple argued that HTC did not have the right to sue by using this “rent-a-patent” model.
SEMICONDUCTOR SERVICES: A company executive said that Taiwanese firms must think about how to participate in global supply chains and lift their competitiveness Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it expects to launch its first multifunctional service center in Pingtung County in the middle of 2027, in a bid to foster a resilient high-tech facility construction ecosystem. TSMC broached the idea of creating a center two or three years ago when it started building new manufacturing capacity in the US and Japan, the company said. The center, dubbed an “ecosystem park,” would assist local manufacturing facility construction partners to upgrade their capabilities and secure more deals from other global chipmakers such as Intel Corp, Micron Technology Inc and Infineon Technologies AG, TSMC said. It
EXPORT GROWTH: The AI boom has shortened chip cycles to just one year, putting pressure on chipmakers to accelerate development and expand packaging capacity Developing a localized supply chain for advanced packaging equipment is critical for keeping pace with customers’ increasingly shrinking time-to-market cycles for new artificial intelligence (AI) chips, Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) said yesterday. Spurred on by the AI revolution, customers are accelerating product upgrades to nearly every year, compared with the two to three-year development cadence in the past, TSMC vice president of advanced packaging technology and service Jun He (何軍) said at a 3D IC Global Summit organized by SEMI in Taipei. These shortened cycles put heavy pressure on chipmakers, as the entire process — from chip design to mass
People walk past advertising for a Syensqo chip at the Semicon Taiwan exhibition in Taipei yesterday.
NO BREAKTHROUGH? More substantial ‘deliverables,’ such as tariff reductions, would likely be saved for a meeting between Trump and Xi later this year, a trade expert said China launched two probes targeting the US semiconductor sector on Saturday ahead of talks between the two nations in Spain this week on trade, national security and the ownership of social media platform TikTok. China’s Ministry of Commerce announced an anti-dumping investigation into certain analog integrated circuits (ICs) imported from the US. The investigation is to target some commodity interface ICs and gate driver ICs, which are commonly made by US companies such as Texas Instruments Inc and ON Semiconductor Corp. The ministry also announced an anti-discrimination probe into US measures against China’s chip sector. US measures such as export curbs and tariffs
RSS