Taiwan had a surplus of US$11.82 billion in its balance of payments in the second quarter, widening a surplus of US$4.59 billion a year earlier, the central bank’s latest tallies released yesterday showed.
The second-quarter surplus contrasted with a US$12.89 billion surplus posted in the first quarter, the central bank said.
The balance of payments is used to measure a nation’s payment flow of goods, services and investment across borders.
In the second quarter, the current-account surplus rose 40.8 percent to US$9.92 billion from US$7.04 billion a year earlier on a deeper decline in imports than that in exports amid the global slump, the central bank said.
The surplus narrowed from a US$12.89 billion surplus in the first quarter, the bank said.
Exports contracted 31.9 percent between April and June, while imports plunged 37.2 percent, Dawn Chen (陳一端), deputy chief of the central bank’s economic research department, told a media briefing.
As for the financial account, the direct and portfolio investment posted a net outflow of US$800 million and US$1.1 billion respectively in the second quarter, which Chen attributed to a rising purchase of foreign mutual funds and bonds by local residents and insurance firms.
The surplus on the income account, which includes dividend payments, widened to US$2.49 billion from US$1.64 billion a year earlier because of less income from direct investment and bank interest amid worldwide interest rate cuts.
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said that its investment plan in Arizona is going according to schedule, following a local media report claiming that the company is planning to break ground on its third wafer fab in the US in June. In a statement, TSMC said it does not comment on market speculation, but that its investments in Arizona are proceeding well. TSMC is investing more than US$65 billion in Arizona to build three advanced wafer fabs. The first one has started production using the 4-nanometer (nm) process, while the second one would start mass production using the
A TAIWAN DEAL: TSMC is in early talks to fully operate Intel’s US semiconductor factories in a deal first raised by Trump officials, but Intel’s interest is uncertain Broadcom Inc has had informal talks with its advisers about making a bid for Intel Corp’s chip-design and marketing business, the Wall Street Journal reported, citing people familiar with the matter. Nothing has been submitted to Intel and Broadcom could decide not to pursue a deal, according to the Journal. Bloomberg News earlier reported that Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) is in early talks for a controlling stake in Intel’s factories at the request of officials at US President Donald Trump’s administration, as the president looks to boost US manufacturing and maintain the country’s leadership in critical technologies. Trump officials raised the
‘SILVER LINING’: Although the news caused TSMC to fall on the local market, an analyst said that as tariffs are not set to go into effect until April, there is still time for negotiations US President Donald Trump on Tuesday said that he would likely impose tariffs on semiconductor, automobile and pharmaceutical imports of about 25 percent, with an announcement coming as soon as April 2 in a move that would represent a dramatic widening of the US leader’s trade war. “I probably will tell you that on April 2, but it’ll be in the neighborhood of 25 percent,” Trump told reporters at his Mar-a-Lago club when asked about his plan for auto tariffs. Asked about similar levies on pharmaceutical drugs and semiconductors, the president said that “it’ll be 25 percent and higher, and it’ll
CHIP BOOM: Revenue for the semiconductor industry is set to reach US$1 trillion by 2032, opening up opportunities for the chip pacakging and testing company, it said ASE Technology Holding Co (日月光投控), the world’s largest provider of outsourced semiconductor assembly and test (OSAT) services, yesterday launched a new advanced manufacturing facility in Penang, Malaysia, aiming to meet growing demand for emerging technologies such as generative artificial intelligence (AI) applications. The US$300 million facility is a critical step in expanding ASE’s global footprint, offering an alternative for customers from the US, Europe, Japan, South Korea and China to assemble and test chips outside of Taiwan amid efforts to diversify supply chains. The plant, the company’s fifth in Malaysia, is part of a strategic expansion plan that would more than triple