While the financial crisis may have daunted investors from risk-taking, Cardif Assurance Vie’s (法國巴黎人壽) Taiwan branch launched yesterday its first investment-linked insurance policy that features a constant dollar plan with a back-end load.
“We hope to rekindle investor confidence in putting down a fixed-amount of investment at regular intervals by launching this new policy, whose back-end load will allow investors to pay sales charges later,” Ben Ng (黃旗興), general manager of the life insurer, told a press conference yesterday.
Compared with policies with a back-end load, most investment-linked insurance policies with a front-end load require policyholders to pay sales charges at the time of the initial purchase of an investment, which usually are mutual funds or insurance policies. The front-end load is deducted from the amount of the investment and as a result lowers the size of the investment.
The plan offers policyholders a 100 percent investment, assistant vice president Tommy Liao (廖正井) said yesterday.
Liao said the life insurer also offered lower management and transaction fees on investments linked to some 300 funds including 30 exchange-traded funds.
Investors will be required to put down a minimum of NT$3,000 monthly or annually, regardless of the share price. Through this, more shares would be purchased when prices are low and fewer when prices are high, the company said.
The New Taiwan dollar is on the verge of overtaking the yuan as Asia’s best carry-trade target given its lower risk of interest-rate and currency volatility. A strategy of borrowing the New Taiwan dollar to invest in higher-yielding alternatives has generated the second-highest return over the past month among Asian currencies behind the yuan, based on the Sharpe ratio that measures risk-adjusted relative returns. The New Taiwan dollar may soon replace its Chinese peer as the region’s favored carry trade tool, analysts say, citing Beijing’s efforts to support the yuan that can create wild swings in borrowing costs. In contrast,
Nvidia Corp’s demand for advanced packaging from Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) remains strong though the kind of technology it needs is changing, Nvidia CEO Jensen Huang (黃仁勳) said yesterday, after he was asked whether the company was cutting orders. Nvidia’s most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a complex chip-on-wafer-on-substrate (CoWoS) advanced packaging technology offered by TSMC, Nvidia’s main contract chipmaker. “As we move into Blackwell, we will use largely CoWoS-L. Of course, we’re still manufacturing Hopper, and Hopper will use CowoS-S. We will also transition the CoWoS-S capacity to CoWos-L,” Huang said
Nvidia Corp CEO Jensen Huang (黃仁勳) is expected to miss the inauguration of US president-elect Donald Trump on Monday, bucking a trend among high-profile US technology leaders. Huang is visiting East Asia this week, as he typically does around the time of the Lunar New Year, a person familiar with the situation said. He has never previously attended a US presidential inauguration, said the person, who asked not to be identified, because the plans have not been announced. That makes Nvidia an exception among the most valuable technology companies, most of which are sending cofounders or CEOs to the event. That includes
INDUSTRY LEADER: TSMC aims to continue outperforming the industry’s growth and makes 2025 another strong growth year, chairman and CEO C.C. Wei says Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), a major chip supplier to Nvidia Corp and Apple Inc, yesterday said it aims to grow revenue by about 25 percent this year, driven by robust demand for artificial intelligence (AI) chips. That means TSMC would continue to outpace the foundry industry’s 10 percent annual growth this year based on the chipmaker’s estimate. The chipmaker expects revenue from AI-related chips to double this year, extending a three-fold increase last year. The growth would quicken over the next five years at a compound annual growth rate of 45 percent, fueled by strong demand for the high-performance computing