SunMax Biotechnology Co (
The company was awarded the design examination certificate for medical devices, presented by EU representative Per Ove Oyberg in Taipei yesterday.
SunMax expects to secure a 30 percent market share this year in Greater China markets by selling 250,000 syringes for more than NT$5 billion (US$159.3 million), an executive told the ceremony.
PHOTO: CNA
"The company expects its market share to grow to 50 percent next year," said SunMax chairman David Wang (王進富), adding that the Tainan-based firm plans an initial public offering in the second half of the year.
"Within the next three to five years, collagens made of cow skin will be entirely replaced by [those made from] pig skin, which is safer and has better quality," he said.
SunMax Biotechnology expects to sell more than 220,000 syringes in China this year and 30,000 in Taiwan.
Sunshine Instrument Ltd (
Anna Hsieh (謝桂鈴), president of Taipei-based Sunshine Instrument, said the firm expects the new product to boost Sunshine Instrument's sales this year by 70 percent to 80 percent after securing NT$180 million in sales last year.
The New Taiwan dollar is on the verge of overtaking the yuan as Asia’s best carry-trade target given its lower risk of interest-rate and currency volatility. A strategy of borrowing the New Taiwan dollar to invest in higher-yielding alternatives has generated the second-highest return over the past month among Asian currencies behind the yuan, based on the Sharpe ratio that measures risk-adjusted relative returns. The New Taiwan dollar may soon replace its Chinese peer as the region’s favored carry trade tool, analysts say, citing Beijing’s efforts to support the yuan that can create wild swings in borrowing costs. In contrast,
Nvidia Corp’s demand for advanced packaging from Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) remains strong though the kind of technology it needs is changing, Nvidia CEO Jensen Huang (黃仁勳) said yesterday, after he was asked whether the company was cutting orders. Nvidia’s most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a complex chip-on-wafer-on-substrate (CoWoS) advanced packaging technology offered by TSMC, Nvidia’s main contract chipmaker. “As we move into Blackwell, we will use largely CoWoS-L. Of course, we’re still manufacturing Hopper, and Hopper will use CowoS-S. We will also transition the CoWoS-S capacity to CoWos-L,” Huang said
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