Fighting poverty, stabilizing Asia's currencies, nurturing its financial markets and assessing China's rising economic clout are some issues expected to top the agenda at the Asian Development Bank's (ADB) ministers' meeting this weekend.
Beginning today, finance officials from more than 60 countries are spending three days at the bank's annual meeting of governors on South Korea's Jeju resort island.
The topics are as broad as Asia is diverse.
Though the region Japan and export powerhouse China, about 720 million Asians -- nearly two-thirds of the world's poor -- still live hand-to-mouth on less than US$1 a day.
That means cutting poverty and hunger are as important as nurturing financial markets and keeping currency speculators at bay for countries like Kazakhstan and Uzbekistan, and Pacific island nations like Kiribati.
The bank said Monday that halving poverty by 2015 -- a goal at the 2002 summit in Johannesburg, South Africa -- would rank atop the agenda.
With the bank forecasting 6.8 percent growth in developing Asian nations this year, ministers are expected to grapple with the tricky task of engineering an expansion without making poverty worse.
Ways to avoid the pitfalls of a possible slowdown in China, terrorism and disease outbreaks -- such as SARS and bird flu -- are also expected to come up.
Ahead of the meeting, officials focused on how to stabilize financial markets and currencies.
Yesterday, South Korea's Finance and Economy Minister Lee Hun-jai said officials were near agreement on a plan to boost foreign currency reserves, currency policy coordination and market monitoring. Such steps have been concerns since massive capital flight from Asia triggered a financial crisis in the late 1990s.
"The vice ministers of South Korea, China and Japan are ... putting the final touches on an agreement," Lee said.
ADB President Tadao Chino said ministers were debating ways to integrate bond markets. This would add to regional programs aimed at sorting out Asia's problems without relying on the World Bank and other international lenders.
Zhang Yazhou was sitting in the passenger seat of her Tesla Model 3 when she said she heard her father’s panicked voice: The brakes do not work. Approaching a red light, her father swerved around two cars before plowing into a sport utility vehicle and a sedan, and crashing into a large concrete barrier. Stunned, Zhang gazed at the deflating airbag in front of her. She could never have imagined what was to come: Tesla Inc sued her for defamation for complaining publicly about the vehicles brakes — and won. A Chinese court ordered Zhang to pay more than US$23,000 in
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said that its investment plan in Arizona is going according to schedule, following a local media report claiming that the company is planning to break ground on its third wafer fab in the US in June. In a statement, TSMC said it does not comment on market speculation, but that its investments in Arizona are proceeding well. TSMC is investing more than US$65 billion in Arizona to build three advanced wafer fabs. The first one has started production using the 4-nanometer (nm) process, while the second one would start mass production using the
‘NO DISRUPTION’: A US trade association said that it was ready to work with the US administration to streamline the program’s requirements and achieve shared goals The White House is seeking to renegotiate US CHIPS and Science Act awards and has signaled delays to some upcoming semiconductor disbursements, two sources familiar with the matter told reporters. The people, along with a third source, said that the new US administration is reviewing the projects awarded under the 2022 law, meant to boost US domestic semiconductor output with US$39 billion in subsidies. Washington plans to renegotiate some of the deals after assessing and changing current requirements, the sources said. The extent of the possible changes and how they would affect agreements already finalized was not immediately clear. It was not known
A TAIWAN DEAL: TSMC is in early talks to fully operate Intel’s US semiconductor factories in a deal first raised by Trump officials, but Intel’s interest is uncertain Broadcom Inc has had informal talks with its advisers about making a bid for Intel Corp’s chip-design and marketing business, the Wall Street Journal reported, citing people familiar with the matter. Nothing has been submitted to Intel and Broadcom could decide not to pursue a deal, according to the Journal. Bloomberg News earlier reported that Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) is in early talks for a controlling stake in Intel’s factories at the request of officials at US President Donald Trump’s administration, as the president looks to boost US manufacturing and maintain the country’s leadership in critical technologies. Trump officials raised the